In: Proceedings of the 5th International Conference on Tangible, Embedded, and Embodied Interaction. International Conference on Tangible, Embedded and Embodied Interaction (TEI-2011), 5th, January 23-26, Funchal, Portugal, Pages 157-164, ISBN 978-1-4503-0478-8, ACM, New York, NY, USA, 1/2011.