Embedded Intelligence

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1. Daniel Geißler; Bo Zhou; Mengxi Liu; Paul Lukowicz

   Latent Boost: Enhancing Interpretability Through Loss-Defined Classification Objective in Structured Latent Spaces

   In: Kohei Arai; Pascal Lorenz (Hrsg.). Intelligent Systems and Applications. Intelligent Systems Conference (IntelliSys), Amsterdam, Pages 91-114, ISBN 978-3-032-32726-0, Springer Nature Switzerland, 2027.

2. Harshita Katoch; David Antony Selby; Gerrit Großmann; Sebastian Vollmer

   Accounting for Bias Enables Sustainable LLM Evaluation

   In: Vitor Fortes Rey; René Schuster; Niklas Baumgarten; Sungho Suh; Tobias Christian Nauen (Hrsg.). Proceedings of the 1st Workshop on Sustainability and Resource-Efficiency of Artificial Intelligence (SuRE 2026) at IJCAI 2026. Workshop on Sustainability and Resource-Efficiency of Artificial Intelligence (SuRE-2026), located at IJCAI-ECAI 2026, August 17, Bremen, Germany, CEUR-WS, ISBN 1613-0073, CEUR-WS, 8/2026.

3. Lars Krupp; Daniel Geißler; Vishal Banwari; Paul Lukowicz; Jakob Karolus

   Promoting Sustainable Web Agents: Benchmarking and Estimating Energy Consumption through Empirical and Theoretical Analysis

   In: Proceedings of the AAAI Conference on Artificial Intelligence. AAAI Conference on Artificial Intelligence (AAAI-2026), Singapur, Singapore, Pages 38772-38780, Vol. 40, No. 45, AAAI, 2026.

4. Jonas Bley; Eva Rexigel; Alda Arias; Lars Krupp; Nikolas Longen; Paul Lukowicz; Stefan Küchemann; Jochen Kuhn; Maximilian Kiefer-Emmanouilidis; Artur Widera

   Visualization enhances problem solving in multiqubit systems

   In: Physical Review Physics Education Research (PRPER), Vol. 22, No. 1, Pages 0-0, APS, 2026.

5. Vitor Fortes Rey; Pedro Martelleto Bressane Rezende; Bo Zhou; Sungho Suh; Paul Lukowicz

   COA-HAR: Exploring contrastive online test-time adaptation for wearable sensor-based human activity recognition using sensor data augmentation

   In: Expert Systems with Applications (ESWA), Vol. 297, Page 129288, Elsevier, 2026.

6. Matthias Tschöpe; Björn Friedrich; Sizhen Bian; Paul Lukowicz

   How Much Context Matters? A Comparison for Skeleton-Based Activity Recognition

   In: 2026 International Conference on Activity and Behavior Computing (ABC). International Conference on Activity and Behavior Computing (ABC-2026), March 9-12, Hakodate, Japan, IEEE, 2026.

7. Hymalai Bello; Lala Ray; Joanna Sorysz; Sungho Suh; Paul Lukowicz

   OpenMarcie: Dataset for Multimodal Action Recognition in Industrial Environments

   In: Proceedings of the IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR). International Conference on Computer Vision and Pattern Recognition (CVPR-2026), June 3-7, Denver, CO, USA, IEEE, 2026.

8. Shilin Shan; Chuhao Zhou; Ruize Wang; Xinyan Chen; Xiangyu Chen; Xinyu Zhou; Boyu Ma; Kirishanth Chethurajah; Jingliang Li; Celeste Yuxuan Hu; Gengyu Liu-Sürücü; Guohao Chen; Tianrui Zhu; Zhen Liu; Yanjie Ze; Haoran Geng; Zhiyang Dou; Jianxin Bi; Yuejiang Liu; Jianshu Zhou; Jiachen Li; Paul Liang; Tatsuya Harada; Robert Katzschmann; Harold Soh; Na Li; Edward Johns; Danica Kragic; Jan Peters; Wojciech Matusik; Masayoshi Tomizuka; Jitendra Malik; Jianfei Yang

   Learning Physical Interaction: A Survey of Tactile- and Force-aware Robot Learning

   In: Computing Research Repository eprint Journal (CoRR), Vol. abs/2608.07558, Pages 1-53, arXiv, 2026.

9. Pixi Kang; Julian Moosmann; Mengxi Liu; Bo Zhou; Michele Magno; Paul Lukowicz; Sizhen Bian

   Bridging Generalization and Personalization in Human Activity Recognition via On-Device Few-Shot Learning

   In: MobileHCI '25: Proceedings of the 27th International Conference on Mobile Human-Computer Interaction. ACM International Conference on Mobile Human-Computer Interaction (MobileHCI-2025), ACM, 9/2025.

10. Yongliang Lin; Yongzhi Su; Sandeep Prudhvi Krishna Inuganti; Yan Di; Naeem Ajiforoushan; Hanqing Yang; Yu Zhang; Jason Raphael Rambach

    Resolving Symmetry Ambiguity in Correspondence-based Methods for Instance-level Object Pose Estimation

    In: IEEE Transactions on Image Processing (TIP), IEEE, 3/2025.

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