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Embedded Intelligence

Publications

Page 1 of 33.

  1. Artificial Intelligence in Wearables – Challenges and Opportunities in Physical Therapy and Sports Training

    In: Proceedings of the Third International Conference on Hybrid Human-Artificial Intelligence. International Conference on Hybrid Human-Artificial Intelligence (HHAI-2024), HHAI 2024: Hybrid Human AI Systems for the Social Good, June 10-14, Malmö, Sweden, Pages 427-433, Vol. 386, ISBN 978-1-64368-522-9, IOS Press, 6/2024.

  2. Tae Yeob Kang; Haebom Lee; Sungho Suh

    An Empirical Study on Fault Detection and Root Cause Analysis of Indium Tin Oxide Electrodes by Processing S-Parameter Patterns

    In: IEEE Transactions on Device and Materials Reliability, Vol. 24, No. 3, Pages 380-389, IEEE, 6/2024.

  3. Passant Alagroudy; Jie Li; Albecht Schmidt; Paul Lukowicz; Kaisa Väänänen; Hirishi Ishii; Antti Oulasvirta; Rui Prada; Giulia Barbareschi; Agnes Grünerbl; Abdallah El Ali; Anicia Peters; Alexandra Deining; Fiona Draxler; Wendy Mackay; Elisatheth Churchill; Julie Williamson; Robin Welsch; Midori Kawaguchi

    Transforming HCI Methods using GenAI and "Large Whatever Models" (LWMs)

    In: Special Interest Group at the ACM CHI Conference on Human Factors in Computing Systems. ACM International Conference on Human Factors in Computing Systems (CHI-2024), May 11-16, Honolulu, Hawaii, USA, ACM, 5/2024.

  4. Unimodal and Multimodal Sensor Fusion for Wearable Activity Recognition

    In: Ph.D Forum on Pervasive Computing and Communications. IEEE International Conference on Pervasive Computing and Communications (PerCom-2024), Pervasive Computing and Communications, located at The 22nd International Conference on Pervasive Computing and Communications (PerCom 2024), March 11-15, Biarritz, France, IEEE PerCom, 3/2024.

  5. iMove: Exploring Bio-Impedance Sensing for Fitness Activity Recognition

    In: 2024 IEEE International Conference on Pervasive Computing and Communications (PerCom). IEEE International Conference on Pervasive Computing and Communications (PerCom-2024), March 11-15, Biarritz, France, Pages 194-205, IEEE Computer Society, 3/2024.

  6. Real-Time and on-the-Edge Multiple Channel Capacitive and Inertial Fusion-Based Glove

    In: International Conference on Body Area Networks. International Conference on Body Area Networks (Bodynets-2024), EAI BODYNETS 2023 2024 - 18th EAI International Conference on Body Area Networks: Intelligent Edge Cloud for Dependable Globally Connected BAN, located at 18th EAI International Conference on Body Area Networks: Intelligent Edge Cloud for Dependable Globally Connected BAN, February 5-6, Milan, Italy, Springer Bodynets, 2/2024.

  7. The Power of Training: How Different Neural Network Setups Influence the Energy Demand

    In: ARCS 2024: International Conference on Architecture of Computing Systems. International Conference on Architecture of Computing Systems (ARCS), HPC - Challenges for Sustainable Computing, Springer, 2024.

  8. Yongliang Lin; Yongzhi Su; Praveen Annamalai Nathan; Sandeep Prudhvi Krishna Inuganti; Yan Di; Martin Sundermayer; Fabian Manhardt; Didier Stricker; Jason Raphael Rambach; Yu Zhang

    HiPose: Hierarchical Binary Surface Encoding and Correspondence Pruning for RGB-D 6DoF Object Pose Estimation

    In: IEEE/CVF (Hrsg.). Proceedings of the. International Conference on Computer Vision and Pattern Recognition (CVPR-2024), June 17-21, Seattle, Washington, USA, IEEE/CVF, 2024.

  9. Lars Krupp; Steffen Steinert; Maximilian Kiefer-Emmanouilidis; Karina E. Avila; Paul Lukowicz; Jochen Kuhn; Stefan Küchemann; Jakob Karolus

    Challenges and Opportunities of Moderating Usage of Large Language Models in Education

    In: Proceedings of Machine Learning Research. AAAI Workshop on AI for Education (AI4ED-2024), Bridging Innovation and Responsibility, located at AAAI 2024, February 20-27, Vancouver, British Columbia, Canada, Proceedings of Machine Learning Research, 2024.

  10. Object Detection for Human-Robot Interaction and Worker Assistance Systems

    In: John Soldatos. Artificial Intelligence in Manufacturing: Enabling Intelligent, Flexible and Cost-Effective Production Through AI. Pages 319-332, ISBN 978-3-031-46452-2, Springer Nature Switzerland, Cham, 2024.

Contact

Office:
Shannon Kittrell, B.A.
Phone: +49 631 20575 4010

Deutsches Forschungszentrum für Künstliche Intelligenz GmbH (DFKI)
Research Department Embedded Intelligence
Trippstadter Str. 122
67663 Kaiserslautern
Germany