Dennis Krummacker; Benedikt Veith; Daniel Lindenschmitt; Hans D. Schotten
In: Annals of Telecommunications, Pages 01-10, Springer, 1/2023.
Dennis Krummacker; Mike Reichardt; Christoph Fischer; Hans D. Schotten
In: ICPS 2023 -- 6th IEEE International Conference on Industrial Cyber-Physical Systems. IEEE International Conference on Industrial Cyber-Physical …
Dennis Krummacker; Christoph Fischer; Benedikt Veith; Hans D. Schotten
In: European Wireless 2023. European Wireless (EW-2023), October 2-4, VDE, 2023.
Jayanth Siddamsetty; Marco Stricker; Marcela Charfuelan Oliva; Marlon Nuske; Andreas Dengel
In: ISPRS Annals of the Photogrammetry, Remote Sensing and Spatial Information Sciences, Vol. X-1/W1-2023, Pages 881-888, Copernicus Publications, …
Christoph Albert Johns; Michael Barz; Daniel Sonntag
In: Dietmar Seipel; Alexander Steen (Hrsg.). KI 2023: Advances in Artificial Intelligence. German Conference on Artificial Intelligence (KI-2023), …
Conrad Zeidler; Matthias Klug; Gerrit Woeckner; Urte Clausen; Johannes Schöning
In: IEEE. IEEE International Symposium on Mixed and Augmented Reality (ISMAR-2023), 22nd IEEE International Symposium on Mixed and Augmented Reality …
Jan Zielasko; Rolf Drechsler
In: Forum on Specification & Design Languages (FDL). Forum on Specification & Design Languages (FDL-2023), September 13-15, Turin, Italy, 2023.
Simon Hagen; Henrik Kortum-Landwehr; Oliver Thomas
In: HLH - Lüftung, Klima, Heizung, Sanitär, Gebäudetechnik, Vol. 74, No. 09, Pages 44-47, VDI Fachmedien, 2023.
Cristina Mihale-Wilson; Simon Hagen; Tobias Kohl; Henrik Kortum-Landwehr; Fabian Illgen; Jonas Rebstadt; Oliver Thomas; Oliver Hinz
In: Wirtschaftsinformatik 2023 Proceedings. Internationale Tagung Wirtschaftsinformatik (WI-2023), September 18-21, Paderborn, Germany, AISeL, 9/2023.
Milan Funck; Sallar Ahmadi-Pour; Vladimir Herdt; Rolf Drechsler
In: FDL. Forum on Specification & Design Languages (FDL-2023), September 12-15, Turin, Italy, IEEE, 2023.
