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Publications

Displaying results 691 to 700 of 14847.

  1. Vidyalakshmi Anilkumar; Felix Hilge; Timo Kepp; Michael Wang-Evers; Spencer Brush; Hinnerk Schulz-Hildebrandt; Gereon Hüttmann; Heinz Handels; Dieter Manstein

    Assessment of intrinsic and extrinsic aging on dermal morphology using optical coherence tomography

    In: Bernard Choi; Haishan Zeng (Hrsg.). Photonics in Dermatology and Plastic Surgery 2023. Photonics in Dermatology and Plastic Surgery, January 28-29, San Francisco, CA, USA, Proceedings of SPIE, Vol. 12352, ISBN 9781510658097, SPIE International Society for Optics and Photonics, 2023.

  2. Marc Steffen Seibel; Hristina Uzunova; Timo Kepp; Heinz Handels

    Anatomical Conditioning for Contrastive Unpaired Image-to-Image Translation of Optical Coherence Tomography Images

    In: 2024 IEEE International Symposium on Biomedical Imaging (ISBI). IEEE International Symposium on Biomedical Imaging (ISBI-2024), Athens, Greece, Pages 1-5, IEEE, 2024.

  3. Andreas Maier; Thomas Deserno; Heinz Handels; Klaus Maier-Hein; Christoph Palm; Thomas Tolxdorff (Hrsg.)

    Bildverarbeitung für die Medizin 2024

    Workshop Bildverarbeitung für die Medizin (BVM-2024), German Conference on Medical Image Computing, ISBN 978-3-658-44037-4, Springer Vieweg, Wiesbaden, Erlangen, 2024.

  4. Francisco Mena; Diego Arenas; Marlon Nuske; Andreas Dengel

    Common Practices and Taxonomy in Deep Multi-view Fusion for Remote Sensing Applications

    In: IEEE Journal of Selected Topics in Applied Earth Observations and Remote Sensing (JSTARS), Vol. 17, Pages 4797-4818, IEEE GRSS, IEEE, 2/2024.

  5. Francisco Mena; Deepak Kumar Pathak; Hiba Najjar; Cristhian Sanchez; Patrick Helber; Benjamin Bischke; Peter Habelitz; Miro Miranda Lorenz; Jayanth Siddamsetty; Marlon Nuske; Marcela Charfuelan Oliva; Diego Arenas; Michaela Vollmer; Andreas Dengel

    Adaptive Fusion of Multi-Modal Remote Sensing data for Optimal Sub-field Crop Yield Prediction

    In: Remote Sensing of Environment (RSE), Vol. 318, Pages 0-20, Elsevier, 3/2025.

  6. Hans D. Schotten Maryam Arabshahi

    6G Data Analytics Platform for Applying Condition Monitoring in Smart Factory

    In: RSAE '23: Proceedings of the 2023 5th International Conference on Robotics Systems and Automation Engineering. International Conference on Robotics Systems and Automation Engineering (RSAE -2023), located at the 5th International Conference on Robotics Systems and Automation Engineering, April 20-22, Online, United Kingdom, Pages 29-33, ISBN 978-1-4503-9851-0, Association for Computing Machinery, New York, NY, United States, 9/2023.

  7. Lars Nolle; Frederic Theodor Stahl; Tarek Elmihoub

    On Explanations for Hybrid Artificial Intelligence

    In: Max Bramer; Frederic Theodor Stahl (Hrsg.). Artificial Intelligence XL - 43rd SGAI International Conference on Artificial Intelligence, AI 2023. SGAI International Conference on Innovative Techniques and Applications of Artificial Intelligence (AI-2023), December 12-14, Cambridge, United Kingdom, Pages 3-15, Lecture Notes in Computer Science (LNCS), Vol. 14381, Springer Nature Switzerland AG, Cham, 12/2023.

  8. Frederic Theodor Stahl; Max Bramer (Hrsg.)

    Artificial Intelligence XL, 43rd SGAI International Conference on Artificial Intelligence, AI 2023, Cambridge, UK, December 12–14, 2023, Proceedings

    SGAI International Conference on Artificial Intelligence (AI-2023), December 12-14, Cambridge, United Kingdom, Lecture Notes in Computer Science (LNCS, volume 14381) (LNCS), ISBN 978-3-031-47993-9, Springer Nature Switzerland AG, Cham, 11/2023.

  9. Wei Jiang; Hans Dieter Schotten

    Hierarchical Cell-Free Massive MIMO for High Capacity with Simple Implementation

    In: 2024 IEEE International Conference on Communications. IEEE International Conference on Communications (ICC-2024), June 9-13, Denver, USA, IEEE, 6/2024.

  10. Simon Häring; Sophie Folawiyo; Mariia Podguzova; Stephan Krauß; Didier Stricker

    Vid2Cuts: A Framework for Enabling AI-Guided Grapevine Pruning

    In: IEEE Access (IEEE), Vol. 12, Pages 5814-5836, IEEE, 1/2024.

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