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Publikationen

Zeige Ergebnisse 291 bis 300 von 13704.

  1. Julius Raphael Stegmann; Michael Gundall; Hans Dieter Schotten

    Smart PRACH Jamming: A Serious Threat for 5G Campus Networks

    In: 2024 IEEE Globecom Workshops. IEEE Global Communications Conference Workshops (Globeccom Wkshps-2024), located at IEEE GLOBECOM 2024, December 8-12, IEEE, 12/2024.

  2. Michael Gundall; Hans Dieter Schotten

    OpenWiFiSync: Open Source Implementation of a Clock Synchronization Algorithm using Wi-Fi

    In: IEEE 29th International Conference on Emerging Technologies and Factory Automation (ETFA). IEEE International Conference on Emerging Technologies and Factory Automation (ETFA-2024), September 9-13, Italy, Vol. 1, IEEE, 9/2024.

  3. Daniel Geißler; Bo Zhou; Hamraz Javaheri; Esther Zahn; Emil Woop; Stefan Schaffer; Paul Lukowicz; Jakob Karolus

    Towards Non-Distracting Smartphone Interaction While Biking Using Capacitive Sensing as Input Device

    In: Companion of the 2024 on ACM International Joint Conference on Pervasive and Ubiquitous Computing. International Joint Conference on Pervasive and Ubiquitous Computing (UbiComp-2024), Pages 181-185, ACM New York, NY, USA, 2024.

  4. Daniel Geißler; Hymalai Bello; Esther Zahn; Emil Woop; Bo Zhou; Paul Lukowicz; Jakob Karolus

    Head'n Shoulder: Gesture-Driven Biking Through Capacitive Sensing Garments to Innovate Hands-Free Interaction

    In: Proceedings of the ACM on Human-Computer Interaction. International Conference on Human-Computer Interaction with Mobile Devices and Services (MobileHCI-2024), Pages 1-20, PACMHCI, Vol. 8, No. 265, ACM New York, NY, USA, 2024.

  5. Jan Petershans; Jan Herbst; Matthias Rüb; Eric Mittag; Hans Dieter Schotten

    Robotic Teleoperation: A Real-World Test Environment for 6G Communications

    In: 28. ITG-Fachtagung Mobilkommunikation. VDE/ITG Fachtagung Mobilkommunikation (MKT-2024), May 15-16, Osnabrück, Germany, Pages 106-111, ISBN 978-3-8007-6382-5, VDE-Verlag, 5/2024.

  6. Konstantin Kuznetsov; Sara-Jane Bittner; Abdulrahman Mohamed Selim; Michael Barz; Daniel Sonntag

    FormTwin: A Framework for Pen-based Data Collection

    In: Adjunct Proceedings of the 32nd ACM Conference on User Modeling, Adaptation and Personalization. International Conference on User Modeling, Adaptation, and Personalization (UMAP-2024), July 1-4, Cagliari, Italy, Pages 132-135, ISBN 979-8-4007-0466-6/24/07, ACM Digital Library, 7/2024.

  7. Mervat Zarour; Qiuheng Zhou; Sergiy Melnyk; Hans Dieter Schotten

    Adaptive Prediction Approach for 3D Geometry-based communication

    In: 2024 IEEE 100th Vehicular Technology Conference (VTC2024-Fall). IEEE Vehicular Technology Conference (VTC-2024), IEEE 100th Vehicular Technology Conference, October 7-10, Washington DC, USA, USA, IEEE Xplore, 11/2024.

  8. Annika Tjabben; Lea Bergkemper; Jan Herbst; Matthias Rüb; Christoph Lipps; Hans Dieter Schotten

    Multipath Signal Prediction for In-Body Nanocommunication with Volatile Particles

    In: European Wireless 2024; 29th European Wireless Conference. European Wireless (EW-2024), located at European Wireless 2024, September 9-11, Brno, Czech Republic, IEEE Xplore, 2024.

  9. Lorena Göritz; Daniel Stattkus; Malte Högemann; Halilcan Coban; Christian Hauff; Katharina Kolodziej; Maike Schmidt; Oliver Thomas

    Designing inclusive learning platforms for ethnic minorities

    In: Maike Klein; Daniel Krupka; Cornelia Winter; Martin Gergeleit; Ludger Martin (Hrsg.). Lecture Notes in Informatics. GI-Informatiktage (Informatik-2024), Lock-in or log out? Wie digitale Souveränität gelingt, September 24-26, Wiesbaden, Germany, Vol. 352, Köllen Druck+Verlag GmbH, Bonn, 9/2024.

  10. Alexis T. Bernhard; Benjamin Blumhofer; Andreas Luxenburger; Daniel Porta; Martin Ruskowski; Achim Wagner

    Leverage Asset Administration Shells to Support Artificial Intelligence Planning

    In: 2024 IEEE 29th International Conference on Emerging Technologies and Factory Automation (ETFA). IEEE International Conference on Emerging Technologies and Factory Automation (ETFA-2024), September 10-13, Padua, Italy, IEEE, 2024.

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