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Publikationen

Zeige Ergebnisse 71 bis 80 von 15167.
  1. Max Friedrich; Mareike Böckel; Oliver Meisenberg; Kathrin Meisenberg; Mattis Hartwig

    Learning from 3D image reconstruction: Reconstructing spatiotemporal distributions of radioactive iodine after nuclear accidents

    In: Science of The Total Environment (Sci Total Environ), Vol. 1011, Page 181159, Elsevier B.V. 1/2026.

  2. Christian G. H. Winter; Nicolas A. Zacharias; Mattis Hartwig

    Using LLMs as sentiment analyzers to predict review helpfulness: first insights to open the black box

    In: Marketing Letters: A Journal of Research in Marketing, Vol. 37, No. 30 (2026), Pages 1-14, Springer Nature, 5/2026.

  3. Sallar Ahmadi-Pour; Luca Müller; Rolf Drechsler

    Exploring the Parameter Space for Constrained Random Verification of RISC-V CPUs

    In: Forum on specification & Design Languages (FDL). Forum on Specification & Design Languages (FDL-2026), September 9-11, Rom, Italy, 2026.

  4. Fynn Meyer; Leon Frölje; Lennart Weingarten; Kamalika Datta; Abhoy Kole; Christoph Lüth; Rolf Drechsler

    An Efficient Encoding for Subset Sum Problem Exploiting QFT-Based Arithmetic Operators

    In: International Conference on Quantum Computing and Engineering (QCE). IEEE International Conference on Quantum Computing and Engineering (QCE), September 13-18, IEEE, 2026.

  5. Catalin Bogdan Ciobanu; Sallar Ahmadi-Pour; Rolf Drechsler; Ingo Feldner

    Forging Robust Building Blocks for Next-Gen RISC-V Chips: Virtual Repository and IP Card

    In: 29th Euromicro Conference Series on Digital System Design (DSD) 2026. Euromicro Conference on Digital System Design (DSD-2026), September 2-4, Krakau, Poland, 2026.

  6. Martha Schnieber; Rolf Drechsler

    Synthesis for testability and verifiability: Polynomial formal verification and test pattern generation for KFDD circuits

    In: Microprocessors and Microsystems (MICPRO), Vol. 124, Science Direct, 2026.

  7. Towards Reliable LLM-Assisted Verification Artifact Generation in EDA

    In: IEEE International Conference on Omni-Layer Intelligent Systems (COINS). IEEE International Conference on Omni-layer Intelligent Systems (IEEE COINS), September 7-9, Bologna, Italy, IEEE, 2026.

  8. Human-Centered Evaluation of an LLM-Based Process Modeling Copilot: A Mixed-Methods Study with Domain Experts

    CHI 2026 Workshop on Human-centered Evaluation and Auditing of Language Models, 3/2026.